OCP Tech Talks: Cooling Environments - Sessions 1&2 (May 24 & 25)

Description

The Cooling Environments Tech Talks will have two sessions. Register here to access both days.

About this event

OCP TECH TALKS: COOLING ENVIRONMENTS

• Session 1 of 2: Tuesday, May 24 - 8:30-11:30am PT
• Session 2 of 2: Wednesday, May 25 - 8:30-11:30am PT

Designed to address the increasing demand for data center cooling innovations, the scope of the Cooling Environments charter is to consolidate five existing Advanced Cooling Solutions (ACS) and Advanced Cooling Facilities (ACF) sub projects — ACS Immersion, ACS Cold Plate, ACS Door Heat Exchanger and Advanced Cooling Facilities and Heat Re-use. The motivation for the formation of this project stems from the increased need for synergies between data center facilities (DCF), ACS and ACF activities within OCP.

High performance computing has used liquid cooling for many years. These solutions have proven to be cost effective and efficient at heat extraction. With the growth of 5G, IoT, VR, CDN, and latency sensitive applications, data centers are being constructed in regions of the globe where cooling becomes quite a challenge. Increased power density also introduces cooling challenges. In these cases liquid cooling, and specifically warm water cooling, becomes an effective alternative for heat extraction.

Hear the latest updates from the OCP Cooling Environments Project

Check out the agenda below! (subject to change without notice)